Unite! Seed Fund: Printed Electronics
A Unite! Seed Fund for Teaching and Learning initiative develops a programme to address the growing demand for expertise in printed and flexible electronics.
Partners from Wrocław University of Science and Technology (project coordinator), Politecnico di Torino, Aalto University, and Grenoble INP-UGA met in Wrocław to further develop a new international short-term programme on printed and flexible electronics.
The proposed Erasmus+ Blended Intensive Programme (BIP) responds to the growing demand for specialists in printed and flexible electronics, an emerging field with applications in sensors, wearable systems, and smart packaging.
The programme will combine online theoretical lectures with intensive hands-on laboratory activities, allowing students to work in international and multidisciplinary teams on real projects in printed electronics.
During the meeting, partners discussed the structure and content of the programme, while also visiting laboratories and engaging with Master's and PhD students from the Faculty of Electronics, Photonics and Microsystems at Wrocław University of Science and Technology.
The new programme is planned to launch in summer 2027.